Layers:16L
Thicknes: 1.8 ±0.18mm
Width/Space:  0.1mm/0.1mm
Min. Hole Size:0.25mm
Surface Treatment:Immersion Silver

Crafts:Step Slot

Inner Glod finger  2Steps HDI Board

Applications:Computer

Layers: 8

Thicknes: 1.2±0.12mm

Min. Hole Size: Via/0.3mm
                Blind Via/0.25mm

Width/Space: 0.1mm/0.1mm

Surface Treatment: Immersion Au 

Crafts:  Micro-via Stack up

Applications:  Mobile Phone, Tablet

Layers:    1

Thicknes:    1.2±0.12mm

Min. Hole Size:    3.0mm

Width/Space:    0.12mm/0.08mm

Surface Treatment:    OSP   

Crafts: Single Side Aluminum Base Board

Special Mechanical Manufacture Parameter

Applications:LED Lighting